Google is set to announce the new Pixel 11 Pro at the upcoming Made by Google event on August 12. As we approach the launch, leaks indicate several hardware shifts aimed at addressing common complaints from current Pixel 10 Pro owners. One of the primary changes involves the transition to the new Tensor G6 processor, which reportedly uses a 2nm manufacturing process. This update aims to improve both overall speed and heat management during heavy use.
Connectivity issues have been a persistent challenge for the Pixel line, and Google appears to be addressing this by replacing the current modem with a MediaTek M90 model. This component is designed to offer better signal stability and higher power efficiency. While the battery capacity is rumored to be slightly smaller than the previous model, the modem efficiency could help offset this impact.
Storage configurations are also changing. Google is moving to 256GB as the new entry-level storage option for the Pro model. However, base RAM for the entry-level configuration will drop to 12GB. On the hardware design front, the back of the device will likely feature a new notification LED referred to as HiLight. This feature replaces the older temperature sensor and allows for customizable light patterns for notifications and interaction with Gemini.
Finally, the camera system is expected to include an improved zoom capability reaching up to 120x. While we expect more software-based camera updates, this zoom range marks a hardware shift from the 100x zoom on the previous version. Potential buyers should keep an eye on the official event for full details on pricing and availability.