Apple may face supply constraints for the upcoming iPhone 18 Pro and the new foldable iPhone Ultra. Semiconductor analyst Tim Culpan reports that Apple is currently struggling to secure enough DRAM to meet production requirements for these devices. Because the A20 Pro chip uses Wafer-Level Multi-Chip Module packaging to integrate the processor and memory, the DRAM must be present during the initial assembly phase. This prevents the company from stockpiling finished processors for later integration.
Chip suppliers are currently prioritizing memory for AI data centers due to higher profit margins. This shift has created a significant capacity crunch for consumer electronics manufacturers. Production at facilities like Foxconn could be impacted by these delays in logic board assembly, which directly translates to limited retail inventory and longer wait times for customers attempting to secure these new models upon release.
Industry analysts also point to the potential for higher retail prices. The cost of RAM is rising, and Apple is reportedly passing these expenses to consumers. Some models could see price increases of up to $300. The foldable iPhone Ultra, which may carry a price tag of $2,500, faces additional complexity in its manufacturing process that could further tighten supply.
Since Apple does not plan to release a lower-cost standard iPhone 18 until early 2027, the initial market pressure will fall squarely on the Pro and Ultra models. Consumers hoping to avoid prolonged delivery estimates should prepare to place preorders as soon as the purchase window opens.